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SemiAnalysis
Bridging the gap between business and the worlds most important industry.
By Dylan Patel · Hundreds of paid subscribers
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Nvidia In The Hot Seat?
Intel Habana, Graphcore, Google TPU, and Nvidia A100 Compared In AI Training
Jun 29
18
10
Qualcomm RFFE Update – $8B By 2025, 2023 iPhone Modem, WiFi 7 and Filter Socket Competition With Broadcom, $3B Automotive RF…
2023 iPhone Modem, WiFi 7 and Filter Socket Competition With Broadcom
Jun 27
3
CXL Enables Microsoft Azure To Cut Server Capital Expenditures By Hundreds Of Millions Of Dollars
Microsoft's first generation memory pooling with CXL can significantly reduce the amount of DRAM needed for servers. Up to 25% of DRAM is stranded, and 50% of VMs never touch 50% of their memory. Reducing overprovisioning and underutilization with CXL pooled memory "represents…
31 min ago
5
Can You Trust Semiconductor Capital Equipment Firms? Supply Chain Or Technology…
Includes Tracking Sheet With 106 Active Projects In Supply Chain
Jun 26
7
10
Most popular
Samsung Electronics Cultural Issues Are Causing Disasters In Samsung Foundry, LSI, And Even DRAM Memory!
31
1
Why America Will Lose Semiconductors
52
24
Nvidia Ada Lovelace Leaked Specifications, Die Sizes, Architecture, Cost, And Performance Analysis
16
4
AMD – To Infinity And Beyond
5
9
Intel Is Throwing The Kitchen Sink, But Is The Turn Around Plan Reasonable?
7
6
Meteor Lake Die Shot and Architecture Analysis – Why Is Intel 4 Only A 40% Area Reduction Versus Intel 7?
1
1
See all popular
New
Community
Die Size And Reticle Conundrum – Cost Model With Lithography Scanner Throughput
A smaller die size isn't always better. In fact, it can significantly increase your cost per wafer if special care isn't give during the design process.
Jun 19
12
11
AMD – To Infinity And Beyond
Infinity Fabric 4 and custom silicon, CDNA 3 MI300 specifications, AMD CPU area efficiency, XDNA and AIE, and 2023 EPS estimates
Jun 17
5
9
Why America Will Lose Semiconductors
Tangible bi-partisan solutions for solving a national security crisis.
Jun 13
52
24
Apple M2 Die Shot and Architecture Analysis – Big Cost Increase And A15 Based IP
Apple announced their new 20 billion transistor M2 SoC at WWDC. Unfortunately, it’s quite a minor uplift in performance in some areas such as CPU…
Jun 10
20
3
Packaging Developments From ECTC 2022
TSMC CoWoS-R+, TSMC 4th Generation SoIC, Intel Collective Die To Wafer Hybrid Bonding, AMD V-Cache, Sony's Leading 1-Micron Pitch Hybrid Bonding…
Jun 8
3
Is Ampere Computing’s Cloud Native Marketing Fluff? – Siryn Ampere One 5nm Architecture, Cost Analysis, and IPO Analysis
We break through the marketing fluff of Ampere. We also did a cost comparison of Ampere's Altra and Altra Max to AMD Milan and Intel Icelake. We also do…
Jun 1
1
2
Meteor Lake Die Shot and Architecture Analysis – Why Is Intel 4 Only A 40% Area Reduction Versus Intel 7?
Die shot analysis shows 40% area reduction on identical structures from Intel 7 to Intel 4. Analysis on Redwood Cove and Crestmont architecture, Foveros…
May 26
1
1
Turning The Titanic – How Intel Is Using Software Acquisitions And Increased Accountability To Attempt To Save The Sinking Ship
We had the chance to ask Pat Gelsinger about Intel's software strategy. His response was quite shocking. In our various discussions with other Intel…
May 18
15
3
See all
Most popular
Samsung Electronics Cultural Issues Are Causing Disasters In Samsung Foundry, LSI, And Even DRAM Memory!
31
1
Why America Will Lose Semiconductors
52
24
Nvidia Ada Lovelace Leaked Specifications, Die Sizes, Architecture, Cost, And Performance Analysis
16
4
AMD – To Infinity And Beyond
5
9
Intel Is Throwing The Kitchen Sink, But Is The Turn Around Plan Reasonable?
7
6
Meteor Lake Die Shot and Architecture Analysis – Why Is Intel 4 Only A 40% Area Reduction Versus Intel 7?
1
1
See all popular
SemiAnalysis
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