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Astera Labs IPO - The Next Connectivity Superhero or Steamrolled By Competition?
Bottoms Up Model, Units, ASP, Revenue, By Hyperscaler Analysis, EPS & Cashflow, Competitive Analysis
Mar 17
•
Dylan Patel
and
Jeremie Eliahou Ontiveros
50
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Astera Labs IPO - The Next Connectivity Superhero or Steamrolled By Competition?
www.semianalysis.com
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2
CXL Is Dead In The AI Era
AI Accelerator Beachfront Considerations, Memory Pooling Negatives, Custom Silicon Adoption
Mar 16
•
Dylan Patel
and
Jeremie Eliahou Ontiveros
74
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CXL Is Dead In The AI Era
www.semianalysis.com
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4
AI Datacenter Energy Dilemma - Race for AI Datacenter Space
Gigawatt Dreams and Matroyshka Brains Limited By Datacenters Not Chips
Mar 13
•
Dylan Patel
,
Daniel Nishball
, and
Jeremie Eliahou Ontiveros
89
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AI Datacenter Energy Dilemma - Race for AI Datacenter Space
www.semianalysis.com
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25
February 2024
Groq Inference Tokenomics: Speed, But At What Cost?
Faster than Nvidia? Dissecting the economics
Feb 21
•
Dylan Patel
and
Daniel Nishball
106
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Groq Inference Tokenomics: Speed, But At What Cost?
www.semianalysis.com
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5
Hybrid Bonding Process Flow - Advanced Packaging Part 5
BESI, EV Group, AMAT, TEL, ASMPT, SET, Shibaura, SUSS Microtec
Feb 9
•
Dylan Patel
,
Myron Xie
, and
Jeff Koch
79
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Hybrid Bonding Process Flow - Advanced Packaging Part 5
www.semianalysis.com
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6
January 2024
Neural Network Quantization & Number Formats From First Principles
Inference & Training - Next Gen Hardware for Nvidia, AMD, Intel, Google, Microsoft, Meta, Arm, Qualcomm, MatX and Lemurian Labs
Jan 11
•
Dylan Patel
144
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Neural Network Quantization & Number Formats From First Principles
www.semianalysis.com
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10
Intel GenAI For Yield, TSMC CFET & 3D Stacking, AMD 3D Device Modeling, Applied Materials Material Innovation, SK Hynix HBM4, Micron 3D DRAM…
China’s CXMT Sanctions Violation, Samsung 1000-layer Vertical NAND (VNAND), Kioxia highest density CMOS bonded to array (CBA) NAND, Micron non-volatile…
Jan 3
•
Dylan Patel
,
Jeff Koch
,
Myron Xie
,
Daniel Nishball
, and
Anand Chamarthy
93
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Intel GenAI For Yield, TSMC CFET & 3D Stacking, AMD 3D Device Modeling, Applied Materials Material Innovation, SK Hynix HBM4, Micron 3D DRAM & FeRAM, Hybrid Bonding vs TCB - IEDM 2023
www.semianalysis.com
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4
December 2023
Inference Race To The Bottom - Make It Up On Volume?
Mixtral Inference Costs on H100, MI300X, H200, A100, Speculative Decoding
Dec 18, 2023
•
Dylan Patel
and
Daniel Nishball
102
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Inference Race To The Bottom - Make It Up On Volume?
www.semianalysis.com
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10
ASML Dilemma: High-NA EUV is Worse vs Low-NA EUV Multi-Patterning
Cost model for low- & high-NA EUV, Technical Challenges
Dec 11, 2023
•
Dylan Patel
,
Jeff Koch
, and
Lithos Graphein
62
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ASML Dilemma: High-NA EUV is Worse vs Low-NA EUV Multi-Patterning
www.semianalysis.com
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15
AMD MI300 Performance - Faster Than H100, But How Much?
MI400 Broadcom + AMD Anti-Nvidia Alliance Coming With UEC and Open XGMI
Dec 6, 2023
•
Dylan Patel
and
Daniel Nishball
79
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AMD MI300 Performance - Faster Than H100, But How Much?
www.semianalysis.com
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16
GPU Cloud Economics Explained – The Hidden Truth
CPU vs GPU Cloud Differences, TCO Model, PUE, Hyperscalers Disadvantage
Dec 4, 2023
•
Dylan Patel
and
Daniel Nishball
94
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GPU Cloud Economics Explained – The Hidden Truth
www.semianalysis.com
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38
November 2023
Microsoft Swallows OpenAI’s Core Team – GPU Capacity, Incentive Structure, Intellectual Property, OpenAI Rump State
OpenAI is nothing without its people.
Nov 20, 2023
•
Dylan Patel
and
Daniel Nishball
73
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Microsoft Swallows OpenAI’s Core Team – GPU Capacity, Incentive Structure, Intellectual Property, OpenAI Rump State
www.semianalysis.com
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8
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